Gene - Detail

Detail of Gene

Basic Information
CGSNL Gene Symbol FLO11
Gene Symbol Synonym OsHsp70CP2, HSP70CP2, OsFLO11, OsFLO11-2, FLO11-2, cpHSP70-2, OsHsp70cp-2, Hsp70cp-2, OsHsp70-2, Hsp70-2, Hsp70-31, OsHsp70-31
CGSNL Gene Name FLOURY ENDOSPERM 11
Gene Name Synonym heat shock protein 70 chloroplast protein 2, HEAT SHOCK PROTEIN 70KD CHLOROPLAST PROTEIN 2, FLOURY ENDOSPERM11-2, plastid HSP70-2, plastid-localized 70-kDa heat shock protein 2, Heat shock protein 70-31
Protein Name HEAT SHOCK PROTEIN 70KD CHLOROPLAST PROTEIN 2
Allele flo11-2, flo11, oshsp70-2, oshsp70-2cr
Chromosome No. 12
Explanation Hsp70-31 in Zhou et al. 2025.
Trait Class Seed - Morphological traits - Endosperm
Seed - Physiological traits - Storage substances
Tolerance and resistance - Stress tolerance
Character as QTL - Grain quality
Character as QTL - Yield and productivity
Expression
Sequence/Locus
cDNA Accession No. AK121949
MSU ID LOC_Os12g14070.1
RAP ID Os12g0244100
Links Oryzabase Chromosome View ( IRGSP 1.0 / Build5 )
RAP-DB ( IRGSP 1.0 / Build5 )
Related IDs List ( IRGSP 1.0 / Build5 )
INSD Accession List
(Test version)
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Map
Locate(cM)
Link map Classical linkage map
References
Lu F., Jiao G., Qiu J., Zhao S., Zhao F., Wang P., Chen L., Chen P., Li X., Dong N., Cao R., Li X., Ruan Z., Shao G., Hu S., Sheng Z., Xie L., Tang S., Hu P., Wei X.
Natl Sci Rev 2025  12(2)  nwae416
A molecular module improves rice grain quality and yield at high temperatures.
Zhou Y., Lv W., Zhu M., Wang C., Yu L., Bao Y., Tang C., Zhang M., Huang Q., Ye D., Lin Y., Shi Y.
BMC Plant Biol. 2025  26(1)  303
Genome-wide analysis of the Hsp70 gene family in rice reveals that OsHsp70-9 plays a significant role in heat stress response.
Liu N., Li J., Wang C.C., Yang T., Li A., Zeng P., Peng H., Zhang Y., Huang D., Zheng X., Zhang X.Q.
Plants (Basel) 2025  14(17) 
Extensin-like Protein OsPEX1 Modulates Grain Filling in Rice.
Pasion E.A., Badoni S., Misra G., Anacleto R., Parween S., Kohli A., Sreenivasulu N.
Plant Biotechnol. J. 2021   
OsTPR boosts the superior grains through increase in upper secondary rachis branches without incurring a grain quality penalty.
Tabassum R., Dosaka T., Ichida H., Morita R., Ding Y., Abe T., Katsube-Tanaka T.
Plant J. 2020  103(2)  604-616
FLOURY ENDOSPERM11-2 encodes plastid HSP70-2 involved with the temperature-dependent chalkiness of rice (Oryza sativa L.) grains.
Zhu X., Teng X., Wang Y., Hao Y., Jing R., Wang Y., Liu Y., Zhu J., Wu M., Zhong M., Chen X., Zhang Y., Zhang W., Wang C., Wang Y., Wan J.
Plant Sci. 2018  277  89-99
FLOURY ENDOSPERM11 encoding a plastid heat shock protein 70 is essential for amyloplast development in rice.
Kim S.R., An G.
J. Plant Physiol. 2013  170(9)  854-63
Rice chloroplast-localized heat shock protein 70, OsHsp70CP1, is essential for chloroplast development under high-temperature conditions.
DB Reference
Gramene ID -
Ontologies
Gene Ontology chloroplast envelope( GO:0009941 )
response to heat( GO:0009408 )
response to cold( GO:0009409 )
response to cadmium ion( GO:0046686 )
protein targeting to chloroplast( GO:0045036 )
protein folding( GO:0006457 )
ATP binding( GO:0005524 )
endosperm development( GO:0009960 )
amyloplast organization( GO:0009660 )
thylakoid( GO:0009579 )
nucleus( GO:0005634 )
mitochondrion( GO:0005739 )
chloroplast stroma( GO:0009570 )
chloroplast( GO:0009507 )
amyloplast( GO:0009501 )
regulation of starch biosynthetic process( GO:0010581 )
Trait Ontology chalky endosperm( TO:0000266 )
heat tolerance( TO:0000259 )
seed quality( TO:0000162 )
grain yield( TO:0000396 )
total soluble sugar content( TO:0000340 )
endosperm storage protein content( TO:0002653 )
growth and development trait( TO:0000357 )
grain size( TO:0000397 )
grain weight( TO:0000590 )
grain number per plant( TO:0000440 )
starch content( TO:0000696 )
endosperm color( TO:0000487 )
floury endosperm( TO:0000104 )
Plant Ontology endosperm development stage( PO:0007633 )
seed( PO:0009010 )
seed development stage( PO:0001170 )
leaf( PO:0025034 )
stem( PO:0009047 )
flower( PO:0009046 )
Related Strains
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Phenotype images
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Last updated
Aug 3, 2026


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